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| Type: | Flexible Circuit Board |
| Dielectric: | Polyimide |
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(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
In the world of flexible electronics, the Black Film Mini OLED Flexible FPC is a high-performance solution designed for applications requiring flexibility, durability, and aesthetic appeal. This 4-layer flexible printed circuit (FPC) is built on a 0.3mm thick base laminate from Shengyi and is manufactured to IPC 6012 Class 2 standards. Featuring a black solder mask and polyimide stiffener, this FPC is ideal for PLC programming, industrial control equipment, and consumer electronics.
Key Features of Black Film Mini OLED Flexible FPC
1.Excellent Flexibility: The FPC can be bent, folded, and wound, making it ideal for applications where space and flexibility are critical.
2.Reduced Volume and Weight: By using FPC, the overall volume and weight of electronic products can be significantly reduced, enabling the development of smaller and lighter devices.
3.Increased Reliability:The polyimide stiffener provides additional structural support, enhancing the durability and reliability of the circuit.
4.Low Cost: The FPC offers a cost-effective solution for low to medium volume production, making it an economical choice for various applications.
5.Consistency in Assembly: The FPC ensures consistent assembly quality, reducing the risk of errors during production.
6.On-Time Delivery: With an on-time delivery rate of over 98%, we ensure timely delivery for your projects.
7.Aesthetic Appeal: The black solder mask not only provides protection but also enhances the visual appeal of the circuit.
Parameter and Data Sheet
| Size of Flexible PCB | 70.18 X 40.28mm |
| Number of Layers | 4 |
| Board Type | Flexible PCB |
| Board Thickness | 0.30mm |
| Board Material | Polyimide 25µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60ºC |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 35 µm |
| Coverlay Colour | Black |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | Polyimide |
| Stiffener Thickness | 0.2mm |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90ºC No peeling after Min. 3 times test |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. |
| Thermal Stress | Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Applications
The Black Film Mini OLED Flexible FPC is well-suited for a variety of applications, including:
1.PLC Programming: Ideal for compact and lightweight designs in programmable logic controllers.
2.Keypad FPC: Ensures reliable performance in keypad designs for industrial and consumer electronics.
3.FFC for Industrial Control Equipment: Suitable for flexible flat cables in industrial control systems.
4.Consumer Game Consoles: Perfect for flexible and durable designs in gaming devices.
Why Choose Black Film Mini OLED Flexible FPC?
1.Versatility: The FPC can be used in a wide range of applications, from consumer electronics to industrial devices.
2.Structural Support: The polyimide stiffener provides additional rigidity where needed, ensuring the FPC can withstand mechanical stress.
3.Cost-Effective: The FPC offers a low-cost alternative to traditional rigid PCBs, making it an economical choice for low to medium volume production.
4.High Reliability: Manufactured to IPC 6012 Class 2 standards, the FPC ensures high quality and reliability.
5.Global Availability: Ready to ship worldwide, ensuring timely delivery for your projects.
Covercoat / Solder Mask
In flexible PCBs, the solder mask, often referred to as covercoat, is typically a polyimide film coated with a semi-cured adhesive. This covercoat is laminated to the flexible circuit under heat and pressure, encapsulating the copper pattern while exposing the solder pads through access holes. The covercoat production sheet is cut slightly smaller than the flexible circuit sheet to avoid premature edge sealing, which could trap air bubbles.
For high-volume production, punching is more cost-effective than drilling. However, when drilling, it is necessary to compensate for dimensional changes in the flexible circuit sheet, which can be as much as 0.2%.
Stiffener Materials
In many applications where components are soldered, flexible boards require external stiffeners for additional support. Common stiffener materials include:
1.Polyimide (PI) or Polyester Film: Commonly used for their balance of flexibility and rigidity. Typical thickness is 125μm (5mil).
2.Glass Fibers (e.g., FR-4): Offers higher hardness compared to PI or polyester, suitable for applications requiring greater rigidity. Thickness ranges from 125μm (5mil) to 3.175mm (125mils).
3.Polymer Materials: Known for low water absorption and high resistance to pressure and temperature.
4.Steel Foil and Aluminum Shim: Provides high hardness and heat dissipation, ideal for designs where mechanical strength and thermal management are critical.
Conclusion
The Black Film Mini OLED Flexible FPC is a high-performance, cost-effective solution designed for applications requiring both flexibility and structural support. With its excellent flexibility, increased reliability, and low cost, it is an ideal choice for engineers working on PLC programming, industrial control systems, and consumer electronics.
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