Tly-5z Double-Sided Copper Clad Laminate Cclraw Materials with Immersion Silver for Combiners
Product Details
| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | Tly-5z Laminate |
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Basic Info.
- Model NO.
- BIC-1588-V1.0
- Material
- Fiberglass Epoxy
- Flame Retardant Properties
- V0
- Mechanical Rigid
- Rigid
- Processing Technology
- Electrolytic Foil
- Base Material
- Aluminum
- Insulation Materials
- Hydrocarbon Resin
- Brand
- Rogers
- Tihickness
- 8mil, 12mil, 20mil, 32mil and 60mil
- Soldermask Color
- Blcak, Blue, Yellow, Red, Green...
- Transport Package
- Packing
- Specification
- ≤ 400mm X 500mm
- Trademark
- Bicheng
- Origin
- China
- HS Code
- 8534009000
- Production Capacity
- 10000PCS/Year
Product Description
TLY-5Z High Frequency PCB
TLY-5Z laminates are advanced glass-filled PTFE composites reinforced with woven fiberglass. The glass-filled structure was created for low density applications with low weight constraints, such as aerospace.
This produces a dimensionally stable composite, which would not be achievable with non-reinforced PTFEs. The low density technique also results in a composite with a low Z axis expansion, which is not attainable with PTFE-rich composites.
DATA SHEET
TLY-5Z laminates exhibit a low dielectric constant and low dissipation factor of 2.2 and 0.0015 respectively at 10 GHz.
They also have good volume resistivity and surface resistivity, with values of 10^9 Mohms/cm and 10^8 Mohms respectively.
Additionally, TLY-5Z has a high dielectric breakdown voltage of 45 kV and a dielectric strength of 770 V/mil.
Compared to conventional 2.2 dielectric constant materials, TLY-5Z has a lower temperature coefficient of dielectric constant (TCDk) of -72 ppm/°C, ranging from -55 to 150°C. However, its thermal conductivity is relatively low at 0.2 W/m/K.
On the other hand, the coefficient of thermal expansion is pretty good. TLY-5Z has half the thermal expansion of PTFE-rich substrates, which allows for improved drilling and thermal cycling. It has 30 and 40 ppm/ºC in the X and Y directions, and 130 ppm/ºC in the Z-axis.
TLY-5Z laminates have excellent mechanical properties. They exhibit a peel strength of 7 lbs./inch for 1 oz copper and a tensile strength of over 9000 psi in both MD and CD directions. Tensile modulus in both directions exceeds 16000 psi, and they can elongate extension by 6% and 6.9%.
When it comes to flexural strength, TLY-5Z performs well, with 10300 psi and 11600 psi in the MD and CD directions respectively. Additionally, the flexural modulus is very high, with values topping 300 thousand and 400 thousand in the MD and CD directions respectively.
TLY-5Z has a negative dimensional stability nominal value of approximately -0.05% on 10 mils and 30 mils thicknesses evaluated after bake in the MD direction. When tested after thermal stress, it tends to express slightly more in the negative direction, with the value being -0.07% on both thicknesses.
TLY-5Z is a low-density laminate, with a density of 1.92 g/cm³. It has a specific heat value of 0.95 J/g/ºC and a low moisture absorption rate of 0.03%.
Finally, TLY-5Z has a Durometer hardness of 68 and is UL 94V-0 compatible.
Our PCB Capability
For TLY-5Z PCB, we can provide you with double layer board, multi-layer board and hybrid designs.
The standard thickness such as 10 mils, 20 mils, 30 mils, 60mils etc are available in house. TLY-5Z can be custom-manufactured in increments of 10 mils (0.250mm).
Finished copper on track lines can be done with 1oz and 2oz.
Our maximum PCB size on high frequency materials is 400mm by 500mm, which can be a single board in the sheet or multiple designs in this panel.
Solder mask of green, black, blue, yellow and red is available in house.
Surface pads plating includes immersion gold, HASL, immersion silver, immersion tin, OSP, pure gold, ENEPIG and bare copper etc.
A type of 60mil TLY-5Z printed circuit board with immersion silver for combiners is now displayed on the screen.
These boards can also be found in the applications of aerospace components,
low weight antennas for aircraft and RF passive components etc.
TLY-5Z is also an attractive choice from a cost perspective. In comparison to traditional PTFE-rich copper clad laminates, the glass-filled structure offers a more cost-effective alternative. TLY-5Z can be employed in high-volume commercial microwave applications when PTFE-rich substrates are too expensive.
TLY-5Z laminates are advanced glass-filled PTFE composites reinforced with woven fiberglass. The glass-filled structure was created for low density applications with low weight constraints, such as aerospace.
This produces a dimensionally stable composite, which would not be achievable with non-reinforced PTFEs. The low density technique also results in a composite with a low Z axis expansion, which is not attainable with PTFE-rich composites.
DATA SHEET
TLY-5Z laminates exhibit a low dielectric constant and low dissipation factor of 2.2 and 0.0015 respectively at 10 GHz.
They also have good volume resistivity and surface resistivity, with values of 10^9 Mohms/cm and 10^8 Mohms respectively.
Additionally, TLY-5Z has a high dielectric breakdown voltage of 45 kV and a dielectric strength of 770 V/mil.
Compared to conventional 2.2 dielectric constant materials, TLY-5Z has a lower temperature coefficient of dielectric constant (TCDk) of -72 ppm/°C, ranging from -55 to 150°C. However, its thermal conductivity is relatively low at 0.2 W/m/K.
On the other hand, the coefficient of thermal expansion is pretty good. TLY-5Z has half the thermal expansion of PTFE-rich substrates, which allows for improved drilling and thermal cycling. It has 30 and 40 ppm/ºC in the X and Y directions, and 130 ppm/ºC in the Z-axis.
TLY-5Z laminates have excellent mechanical properties. They exhibit a peel strength of 7 lbs./inch for 1 oz copper and a tensile strength of over 9000 psi in both MD and CD directions. Tensile modulus in both directions exceeds 16000 psi, and they can elongate extension by 6% and 6.9%.
When it comes to flexural strength, TLY-5Z performs well, with 10300 psi and 11600 psi in the MD and CD directions respectively. Additionally, the flexural modulus is very high, with values topping 300 thousand and 400 thousand in the MD and CD directions respectively.
TLY-5Z has a negative dimensional stability nominal value of approximately -0.05% on 10 mils and 30 mils thicknesses evaluated after bake in the MD direction. When tested after thermal stress, it tends to express slightly more in the negative direction, with the value being -0.07% on both thicknesses.
TLY-5Z is a low-density laminate, with a density of 1.92 g/cm³. It has a specific heat value of 0.95 J/g/ºC and a low moisture absorption rate of 0.03%.
Finally, TLY-5Z has a Durometer hardness of 68 and is UL 94V-0 compatible.
Our PCB Capability
For TLY-5Z PCB, we can provide you with double layer board, multi-layer board and hybrid designs.
The standard thickness such as 10 mils, 20 mils, 30 mils, 60mils etc are available in house. TLY-5Z can be custom-manufactured in increments of 10 mils (0.250mm).
Finished copper on track lines can be done with 1oz and 2oz.
Our maximum PCB size on high frequency materials is 400mm by 500mm, which can be a single board in the sheet or multiple designs in this panel.
Solder mask of green, black, blue, yellow and red is available in house.
Surface pads plating includes immersion gold, HASL, immersion silver, immersion tin, OSP, pure gold, ENEPIG and bare copper etc.
A type of 60mil TLY-5Z printed circuit board with immersion silver for combiners is now displayed on the screen.
These boards can also be found in the applications of aerospace components,
low weight antennas for aircraft and RF passive components etc.
TLY-5Z is also an attractive choice from a cost perspective. In comparison to traditional PTFE-rich copper clad laminates, the glass-filled structure offers a more cost-effective alternative. TLY-5Z can be employed in high-volume commercial microwave applications when PTFE-rich substrates are too expensive.
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