Rogers Rt/Duroid 5880 High Frequency PCB for Electronic Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Glass Microfiber Reinforced PTFE Composites
• Model NO.: BIC-191-V2.0
• Material: Rt/Duroid 5880
• Application: Commercial Airline Broadband Antennas
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Enig
• Base Material: Rt/Duroid 5880
• Insulation Materials: Glass Microfiber Reinforced PTFE Composite
• Brand: Rogers
• Final Foil External: 1 Oz
• Surface Finish: Immersion Gold
• Minimumtrace and Space: 4 Mil/4 Mil
• Minimum / Maximum Holes: 0.3/4.2mm
• Via: Plated Through Hole(Pth), Via Tented. Blind Via F
• Test: 100% Electrical Test Prior Shipment
• Transport Package: Vacuum
• Specification: 91x 62mm=1PCS
• Trademark: Bicheng Enterprise Limited
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

Rogers RT/Duroid 5880 31mil 0.787mm High Frequency PCB for Point to Point Digital Radio Antennas
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RT/duroid 5880 high frequency material is glass microfiber reinforced PTFE composites which is designed for exacting stripline and microstrip circuit applications. The exceptional dielectric constant uniformity results from its randomly oriented microfibers. The dielectric constant of RT/duroid 5880 is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5880 to Ku-band and above. RT/duroid 5880 materials are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes.

The typical applications are commercial airline broadband antennas, microstrip circuits, stripline circuits, millimeter wave applications, radar systems, missile guidance systems and point to point digital radio antennas etc.

PCB Specifications

Rogers RT/Duroid 5880 31mil 0.787mm High Frequency PCB for Point to Point Digital Radio Antennas
PCB SIZE	91 x 62mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 35um(1 oz)+plate TOP layer
	RT/duroid 0.787mm (31 mil)
	copper ------- 35um(1oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space:	4 mil / 4 mil
Minimum / Maximum Holes:	0.3 mm / 4.2 mm
Number of Different Holes:	9
Number of Drill Holes:	101
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	RT/duroid 0.787mm (31 mil)
Final foil external:	1 oz
Final foil internal:	N/A
Final height of PCB:	0.9 mm ±0.1
PLATING AND COATING
Surface Finish	Immersion gold
Solder Mask Apply To:	N/A
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	N/A
Colour of Component Legend	N/A
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCB.DOC etc
SERVICE AREA	Worldwide, Globally.

Data Sheet of Rogers 5880 (RT/duroid 5880)

RT/duroid 5880 Typical Value
Property	RT/duroid 5880		Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	2.20 2.20±0.02 spec.		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign	2.2		Z	N/A	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0004 0.0009		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε	-125		Z	ppm/ºC	-50ºCto 150ºC	IPC-TM-650 2.5.5.5
Volume Resistivity	2 x 10^7		Z	Mohm cm	C/96/35/90	ASTM D 257
Surface Resistivity	3 x 10^7		Z	Mohm	C/96/35/90	ASTM D 257
Specific Heat	0.96(0.23)		N/A	j/g/k (cal/g/c)	N/A	Calculated
Tensile Modulus	Test at 23ºC	Test at 100ºC	N/A	MPa(kpsi)	A	ASTM D 638
	1070(156)	450(65)	X
	860(125)	380(55)	Y
Ultimate Stress	29(4.2)	20(2.9)	X
	27(3.9)	18(2.6)	Y
Ultimate Strain	6	7.2	X	%
	4.9	5.8	Y
Compressive Modulus	710(103)	500(73)	X	MPa(kpsi)	A	ASTM D 695
	710(103)	500(73)	Y
	940(136)	670(97)	Z
Ultimate Stress	27(3.9)	22(3.2)	X
	29(5.3)	21(3.1)	Y
	52(7.5)	43(6.3)	Z
Ultimate Strain	8.5	8.4	X	%
	7.7	7.8	Y
	12.5	17.6	Z
Moisture Absorption	0.02		N/A	%	0.62"(1.6mm) D48/50	ASTM D 570
Thermal Conductivity	0.2		Z	W/m/k	80ºC	ASTM C 518
Coefficient of Thermal Expansion	31 48 237		X Y Z	ppm/ºC	0-100ºC	IPC-TM-650 2.4.41
Td	500		N/A	ºC TGA	N/A	ASTM D 3850
Density	2.2		N/A	gm/cm^3	N/A	ASTM D 792
Copper Peel	31.2(5.5)		N/A	Pli(N/mm)	1oz(35mm)EDC foil after solder float	IPC-TM-650 2.4.8
Flammability	V-0		N/A	N/A	N/A	UL 94
Lead-free Process Compatible	Yes		N/A	N/A	N/A	N/A