RO4835 Ultra-Thin 0.3mm|6.6mil PCB: Precision High-Frequency Circuit for Compact RF Designs

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4535
• Model NO.: BIC-1111-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

RO4835 Ultra-Thin 0.3mm PCB: Precision High-Frequency Circuit for Compact RF Designs
(Engineered for millimeter-wave and automotive radar applications with superior signal integrity.)


1. Cutting-Edge RF Solution
This exceptionally thin (0.3mm) 2-layer PCB utilizes Rogers RO4835 laminate to deliver outstanding high-frequency performance in a miniature footprint. Designed for automotive radar (77GHz), point-to-point microwave, and phased-array systems, it combines low-loss characteristics with enhanced oxidation resistance, making it ideal for demanding environments.

Key Advantages
Ultra-Compact Design: 5mm × 9mm form factor with 4/4 mils trace/space for high-density layouts

Enhanced Signal Integrity: Tight Dk control (3.48 ±0.05) and low loss tangent (0.0037 @ 10GHz)

Thermal Reliability: Withstands -100°C to +250°C with Tg >280°C and low Z-axis CTE (31ppm/°C)

Manufacturing Efficiency: Compatible with standard FR-4 processes for cost-effective production


2. Technical Specifications

Parameter	Specification
Base Material	Rogers RO4835 (hydrocarbon/ceramic/glass)
Layers	2-layer rigid PCB
Dimensions	5.0mm × 9.0mm (±0.15mm)
Thickness	0.3mm (0.168mm core + 35µm Cu each side)
Copper Weight	1oz (35µm) per layer
Trace/Space	4/4 mils (minimum)
Min. Hole Size	0.2mm (laser-drilled recommended)
Surface Finish	Immersion Gold (ENIG) for reliable RF performance
Solder Mask	None (bare copper for minimal parasitic effects)
Silkscreen	None
Via Plating	20µm thickness
Quality Standard	IPC-Class-2

3. Stackup & Performance Highlights
Layer Structure

Top Layer: 35µm copper + ENIG finish

Core: RO4835 dielectric (0.168mm, Dk=3.48)

Bottom Layer: 35µm copper


Design Features
Component Integration: Supports 1 component with 3 pads (2 thru-hole, 1 SMT)

Interconnects: 2 vias for layer transitions

Signal Paths: 1 net for simplified RF routing

Thermal Stability: Low in-plane CTE (10/12 ppm/°C) prevents warping


Material Benefits
Oxidation-Resistant: Outperforms standard hydrocarbon materials

CAF Resistant: Ensures long-term reliability in humid conditions

LoPro Copper Option: Available for ultra-low insertion loss designs


4. Target Applications
Automotive Radar: 77GHz ADAS sensors and collision avoidance systems

Microwave Communications: Point-to-point radio links and 5G mmWave

Defense/Aerospace: Phased-array radar and RF components

Power Amplifiers: High-efficiency RF front-end modules


5. Why Choose This PCB?
Miniaturization: Ideal for space-constrained mmWave designs

High-Frequency Optimized: ENIG finish preserves signal integrity up to 100GHz+

Cost-Effective: RO4835 reduces costs vs. PTFE without sacrificing performance

Rapid Prototyping: Global availability for quick-turn production


Start Your Miniature RF Design Today
Contact us for design support or instant quoting. Perfect for engineers developing compact, high-frequency systems with strict performance requirements.



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