Rogers RO3210 High Frequency PCB Board Coating Immersion Gold with 94V0

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Ceramic-Filled PTFE Laminate/ Woven Fiberglasss
• Model NO.: BIC-144-V2.0
• Material: Rogers RO3210
• Application: Automotive Radar
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Rogers RO3210
• Insulation Materials: PTFE-Ceramic with Woven Fiberglass
• Brand: Rogers
• Surface Finish: Bare Copper, HASL, Immersion Tin, Immersion Silver
• Copper Weight: 1oz (35µm), 2oz (70µm)
• PCB Thickness: 25mil(0.635mm), 50mil (1.27mm)
• Service Area: Worldwide
• Transport Package: Vacuum
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng Enterprise Limited
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hello Everyone,
Today we're talking about RO3210 high frequency PCBs.

RO3210 high frequency circuit laminates are ceramic-filled laminates reinforced with woven fiberglass. RO3210 material was designed as an extension of the RO3000 series high frequency circuit materials with one distinguishing characteristic-- improved mechanical stability.

Features and benefits are as follows:
1. Woven glass reinforcement, improves rigidity for easier handling.
2. Uniform electrical and mechanical performance, is ideal for complex multi-layer high frequency structure.
3. Low in-plane expansion coefficient matches to copper, which is reliable for surface mounted assemblies; which is suitable for use with epoxy multi-layer board hybrid designs.
4. Excellent dimensional stability, results in high production yields.
5. Surface smoothness, allows for finer line etching tolerance.

Our PCB Capability (RO3210)

PCB Capability (RO3210)
PCB Material:	Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation:	RO3210
Dielectric constant:	10.2±0.5
Layer count:	Single Layer, Double Layer, Multilayer, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
PCB thickness:	25mil(0.635mm), 50mil (1.27mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, Immersion tin, Immersion silver, Immersion gold, Pure gold, ENEPIG,  OSP etc..

Double layer RO3210 high frequency PCBs are available with 0.5oz to 2oz finished copper, 0.7mm and 1.3mm thick, maximum size 400mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.


Typical applications
1. Automotive collision avoidance systems.
2. Automotive global positions satellite antennas
3. Base station infrastructure
4. Datalink on cable systems
5. Direct broadcast satellite
6. LMDS and wireless broadband
7. Microstrip patch antennas for wireless communications
8. Power backplanes
9. Remote meter readers
10. Wireless telecommunications systems

The basic colour of RO3210 PCB is white.

The manufacturing process of RO3210 high frequency PCB is similar to standard PTFE PCB, so it's suitable for volume manufacturing process winning advantageous market.
Should you have any questions, please feel free to contact us.
Thank you for your reading.

Appendix: Data sheet of RO3210

Property	Typical Value RO3210	Direction	Unit	Condition	Test Method
Dielectric Constant, er Process	10.2± 0.50	Z	-	10 GHz 23°C	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, er Design	10.8	Z	-	8  GHz - 40 GHz	Differential Phase Length Method
Dissipation Factor, tan d	0.0027	Z	-	10 GHz 23°C	IPC-TM-650 2.5.5.5
Thermal Coefficient of er	-459	Z	ppm/°C	10 GHz 0-100°C	IPC-TM-650 2.5.5.5
Dimensional Stability	0.8	X,Y	mm/m	COND A	ASTM D257
Volume Resistivity	10^3		MW•cm	COND A	IPC 2.5.17.1
Surface Resistivity	10^3		MW	COND A	IPC 2.5.17.1
Tensile Modulus	579 517	MD CMD	kpsi	23°C	ASTM D638
Water Absorption	<0.1	-	%	D24/23	IPC-TM-650 2.6.2.1
Specific Heat	0.79		J/g/K		Calculated
Thermal Conductivity	0.81	-	W/m/K	80°C	ASTM C518
Coefficient of Thermal Expansion (-55 to 288 °C)	13 34	X,Y, Z	ppm/°C	23°C/50% RH	IPC-TM-650 2.4.41
Td	500		°C	TGA	ASTM D3850
Color	Off White
Density	3.0		gm/cm3
Copper Peel Strength	11.0		pli	1 oz. EDC After Solder Float	IPC-TM-2.4.8
Flammability	V-0				UL 94
Lead Free Process Compatible	YES