15-60mil Rogers Tmm4 RF Microwave PCB High Frequency PCB

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Tmm4
• Model NO.: BIC-103-V2.1
• Material: Ceramic, Hydrocarbon and Thermoset Polymer
• Application: Aerospace
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Tmm4
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Application Thickness Mil: Stripline and Microstrip
• Copper Weight: 1oz or 2 Oz
• Solder Mask: Green, Black, Blue, Yellow, Red etc.
• Dielectric Constant: 4.5 ±0.045
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers TMM4 Microwave PCB 15mil 20mil 25mil 30mil 50mil 60mil with Immersion Gold for Stripline and Microstrip Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Overview of This PCB
Rogers TMM4 thermoset microwave material is ceramic, hydrocarbon, thermoset polymer composite designed for high plated-through-hole reliability stripline and microstrip applications. It's available with dielectric constant at 4.70. The electrical and mechanical properties of TMM4 combine many of the benefits of both ceramic and traditional PTFE microwave circuit materials, without requiring the specialized production techniques. It does not require a sodium napthanate treatment prior to electroless plating.

TMM4 PCB has an exceptionally low thermal coefficient of dielectric constant, typically less than 30 PPM/°C. The material's isotropic coefficient of thermal expansion, very closely matched to copper, allows for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM4 is approximately twice that of traditional PTFE/ceramic materials, facilitating heat removal.
 
TMM4 laminate is based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.

 
2.Our PCB Capability (TMM4)

PCB Material:	Composite of Ceramic, hydrocarbon and thermoset polymer
Designator:	TMM4
Dielectric constant:	4.5  ±0.045 (process);                                                               4.7 (design)
Layer count:	Single Sided, Double Sided, Multi-layer, Hybrid designs
Copper weight:	1oz (35µm), 2oz (70µm)
Laminate thickness:	15mil (0.381mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm), 150mil (3.810mm), 200mil (5.08mm), 250mil (6.35mm), 500mil (12.7mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, Pure gold (no nickle under gold), OSP, ENEPIG

3.Typical Applications
Chip testers
Dielectric polarizers and lenses
Filters and coupler
Global Positioning Systems Antennas
Patch Antennas
Power amplifiers and combiners
RF and microwave circuitry
Satellite communication systems
 

 4.Data Sheet of TMM4

TMM4 Typical Value
Property		TMM4	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess		4.5±0.045	Z		10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign		4.7	-	-	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor (process)		0.002	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant		+15	-	ppm/°K	-55ºC-125ºC	IPC-TM-650 2.5.5.5
Insulation Resistance		>2000	-	Gohm	C/96/60/95	ASTM D257
Volume Resistivity		6 x 108	-	Mohm.cm	-	ASTM D257
Surface Resistivity		1 x 109	-	Mohm	-	ASTM D257
Electrical Strength(dielectric strength)		371	Z	V/mil	-	IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)		425	425	ºCTGA	-	ASTM D3850
Coefficient of Thermal Expansion - X		16	X	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y		16	Y	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z		21	Z	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity		0.7	Z	W/m/K	80 ºC	ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress		5.7 (1.0)	X,Y	lb/inch (N/mm)	after solder float 1 oz. EDC	IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)		15.91	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)		1.76	X,Y	Mpsi	A	ASTM D790
Physical Properties
Moisture Absorption (2X2)	1.27mm (0.050")	0.07	-	%	D/24/23	ASTM D570
	3.18mm (0.125")	0.18
Specific Gravity		2.07	-	-	A	ASTM D792
Specific Heat Capacity		0.83	-	J/g/K	A	Calculated
Lead-Free Process Compatible		YES	-	-	-	-

5. TMM4 Laminate - Key Electrical & Mechanical Parameters
Laminate thickness range & flatness
In addition to the 15-60mil stock thicknesses, TMM4 can be supplied from 10mil to 125mil. Typical warp and twist are <0.05 mm/cm after solder reflow, ensuring good coplanarity for large-area patch antennas.

Copper surface profile & oxide treatment
The laminate accepts standard brown oxide or alternative bond films without adhesion loss. Surface roughness (Rz) of the copper foil is controlled between 1.5-2.5μm, which balances low conductor loss and good dielectric bonding.

High-frequency consistency across panels
Lot-to-lot Dk variation is held within ±0.03 (10 GHz, IPC-TM-650 2.5.5.5). This allows designers to reproduce filter responses and coupler coupling ratios without retuning, saving engineering time in mass production.

Moisture absorption & electrical stability
TMM4 absorbs less than 0.1% moisture after 24 hours immersion (tested per IPC-TM-650 2.6.2). The dielectric constant does not shift more than 0.01 under 90% RH at 40°C, making it suitable for outdoor base station and satellite downlink modules.

6. Why Choose This PCB?
TMM4 PCBs eliminate the need for costly sodium naphthalate etching, reducing hazardous waste and processing lead time. The thermoset resin allows standard FR-4 fabrication lines to produce high-frequency boards without special handling, lowering prototype costs by up to 30%. Its thermal coefficient of Dk (<30 ppm/°C) ensures stable gain across temperature for power amplifiers and GPS antennas. The CTE match to copper (12-14 ppm/°C in X/Y) prevents via cracking after repeated thermal cycles, proven by >2,000 IPC thermal stress tests. For wire-bonded chip testers, the material does not soften at 150°C, eliminating pad lifting. Thermal conductivity (0.7 W/m·K) is double that of traditional PTFE/ceramic blends, helping dissipate heat from high-power RF devices. Whether you design satellite transceivers or automotive radars, TMM4 delivers consistent, predictable performance without PTFE-related handling issues.

Tags: Rogers TMM4 PCB, microwave laminate Dk 4.7, immersion gold RF board, thermoset ceramic hydrocarbon material, high PTH reliability laminate, low TCDk substrate, GPS antenna PCB, satellite communication board, patch antenna TMM4, power amplifier PCB material

7. Order Now for Satellite & RF Communication Systems
Order now for your next-generation satellite payload, automotive radar, or wideband power amplifier - our TMM4 PCBs are backed by full electrical test and impedance control reports. With stock thicknesses ready for prototype runs and volume production, you get a reliable, PTFE-free microwave board delivered in 5-7 working days.