2-Layer 1.1mm F4btms233 PCB Board at Low Electronic Components Price

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: F4btms233
• Model NO.: BIC-1342-V2.1
• Material: Ceramic-PTFE Composite
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Wangling
• Surface Finish: OSP
• Board Thickness: 1.1mm (Finished)
• Layer Count: 2-Layer
• Solder Mask: Blue(Top)
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: 40mm × 108mm (± 0.15mm)
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

2-Layer 1.1mm F4BTMS233 Aerospace PCB for Radar & Satellite Communications

(All PCBs are custom-manufactured. Specifications may vary based on design requirements.)
 

1. PCB Overview

This 2-layer rigid PCB employs advanced F4BTMS233 ceramic-PTFE composite to deliver exceptional high-frequency performance in aerospace systems. Measuring 40mm × 108mm (1PCS, ±0.15mm tolerance) with a controlled thickness of 1.1mm, it meets IPC-Class-2 quality standards.
Featuring blue solder mask (top side only) and white silkscreen (top layer), the board utilizes OSP (Organic Solderability Preservative) surface finish for cost-effective solderability. With 5/4 mil trace/space capability and 0.3mm minimum drilled holes, it supports complex microwave circuits. All vias feature 20μm plating thickness for reliable conductivity, backed by 100% electrical testing pre-shipment.
 

 

2. PCB Construction Details

Parameter	Specification
Layer Count	2-layer rigid
Base Material	F4BTMS233 Nano-Ceramic Composite
Board Dimensions	40mm × 108mm (±0.15mm)
Finished Thickness	1.1mm
Min Trace Width	5 mils
Min Trace Spacing	4 mils
Min Hole Size	0.3mm
Via Type	Through-hole only (No blind/buried)
Finished Cu Weight	1oz (35μm) outer layers
Via Plating Thickness	20μm
Surface Finish	OSP (Organic Solderability Preservative)
Top Silkscreen	White
Bottom Silkscreen	None
Top Solder Mask	Blue
Bottom Solder Mask	None
Electrical Test	100% tested pre-shipment

3. Other Key Components & Features

Component Integration & Statistics

Components: 27
Pads: 62 total (36 thru-hole + 26 top SMT)
Vias: 41

Nets: 2
*Artwork Format: Gerber RS-274-X*
Availability: Worldwide
 

 PCB Stackup Structure

Layer	Thickness	Material
Top Copper (L1)	35μm	RTF Copper Foil
Core	1.016mm (40mil)	F4BTMS233 Composite
Bottom Copper (L2)	35μm	RTF Copper Foil

F4BTMS233 Material Advantages

This aerospace-grade material combines nano-ceramics with ultra-fine glass fiber in PTFE matrix for breakthrough performance:

Key Properties

Dielectric Constant (Dk): 2.33 @ 10GHz
Dissipation Factor (Df): 0.0010 @ 10GHz (0.0011 @ 20GHz)
CTE Stability: X/Y/Z = 35/40/220 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk: -122 ppm/°C
Flammability: UL 94-V0
Moisture Absorption: 0.02%

Performance Benefits

Ultra-low signal loss at Ka-band frequencies
Reduced anisotropy for consistent phase response
Enhanced thermal conductivity vs conventional PTFE
Superior dimensional stability under thermal cycling
RTF copper foil minimizes conductor loss
CAF resistance for harsh environments
 

 Target Applications

Aerospace Avionics: Cabin control systems
Phased Array Radar: Military/weather radar feed networks
Satellite Comms: LEO/MEO transceiver modules
Missile Guidance Systems: RF seeker heads
5G Base Stations: mmWave antenna arrays

Why Choose This PCB?

This 1.1mm F4BTMS233 PCB delivers unmatched high-frequency stability for mission-critical aerospace systems. Its ceramic-enhanced formulation provides ultra-low loss, minimal Dk drift, and exceptional thermal resilience - outperforming conventional PTFE composites. Compliant with IPC-Class-2 standards and globally available, it enables next-generation radar and satellite designs.
Tags: F4BTMS233 PCB, Aerospace PCB, Radar Circuit Board, Satellite Communication PCB, Low Dk PCB, Ceramic-Filled PTFE PCB
Power Your Aerospace Innovations!
Deploy this cutting-edge 2-Layer F4BTMS233 PCB to achieve signal integrity in extreme environments - engineered for reliability across orbital, stratospheric, and terrestrial missions.