RO4350b High-Frequency Double-Layer PCB - 13.3mil (0.338mm) Thickness with Immersion Gold Finish for Automotive Radar and Sensors

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4350b
• Model NO.: BIC-1304-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

RO4350B High-Frequency Double-Layer PCB - 13.3mil (0.338mm) Thickness with Immersion Gold Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Product Overview
The RO4350B high-frequency PCB is a cost-effective double-layer circuit board designed for RF and microwave applications. Featuring a 0.338mm (13.3mil) core thickness and 0.45mm finished thickness, this PCB combines excellent electrical performance with FR-4-like manufacturability.

Key characteristics include:

Controlled dielectric constant (Dk 3.48±0.05 @ 10GHz)

Low loss tangent (0.0037 @ 10GHz)

Excellent thermal stability (Tg >280°C)

UL 94 V-0 flammability rating

Immersion gold surface finish for superior corrosion resistance



2. PCB Construction Specifications

Parameter	Specification
Base Material	Rogers RO4350B
Layer Count	2-layer
Board Dimensions	94.6mm × 83.3mm (±0.15mm)
Core Thickness	0.338mm (13.3mil)
Finished Thickness	0.45mm
Copper Weight	1oz (35μm)
Minimum Trace/Space	6/7 mils
Minimum Hole Size	0.3mm
Via Plating	20μm
Surface Finish	Immersion Gold
Solder Mask	None (Top & Bottom)
Silkscreen	None (Top & Bottom)
Electrical Testing	100% tested

3. Technical Advantages
Material Benefits:

FR-4 compatible processing - No special handling required

Copper-matched CTE - Excellent dimensional stability (10/12/32 ppm/°C)

Thermally robust - Withstands high processing temperatures (>280°C Tg)

Cost-effective - Priced significantly lower than PTFE alternatives


Performance Features:

Consistent Dk across temperature variations

Low moisture absorption (0.06%)

Reliable plated through-holes for thermal cycling applications

Suitable for mixed dielectric multilayer constructions


4. Typical Applications

5G infrastructure - Base station antennas and power amplifiers

Automotive electronics - Radar systems and collision avoidance sensors

Satellite communications - LNB modules for direct broadcast

RFID systems - High-frequency identification tags

IoT devices - Wireless connectivity modules


5. Why Choose RO4350B PCBs?
The RO4350B material offers the perfect balance of:

PTFE-like RF performance at FR-4 production costs

Excellent thermal stability for high-power applications

Proven reliability in demanding environments

Simplified manufacturing compared to traditional RF materials


This double-layer configuration is ideal for prototypes and production runs requiring consistent high-frequency performance with reduced fabrication complexity.



Thank you for your reading and you're welcome to contact us for your PCB enquiries.