Rogers Rt/Duroid 5880 RF PCB Laminate for High-Frequency Electronics

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Product Details
Customization: Available
Type: Rigid Laminate
Dielectric: PTFE Microwave Substrate
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  • Rogers Rt/Duroid 5880 RF PCB Laminate for High-Frequency Electronics
  • Rogers Rt/Duroid 5880 RF PCB Laminate for High-Frequency Electronics
  • Rogers Rt/Duroid 5880 RF PCB Laminate for High-Frequency Electronics
  • Rogers Rt/Duroid 5880 RF PCB Laminate for High-Frequency Electronics
  • Rogers Rt/Duroid 5880 RF PCB Laminate for High-Frequency Electronics
  • Rogers Rt/Duroid 5880 RF PCB Laminate for High-Frequency Electronics
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Basic Info.

Model NO.
BIC-1621-V3.0
Material
Rogers Rt/Duroid 5880
Application
Atellite Communications, Radar Systems
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Bare Copper,Electrodeposited Copper
Base Material
Rogers Rt/Duroid 5880
Insulation Materials
PTFE
Brand
Rogers
Board Types
Rigid Laminate
Test
100% Electrical Test Prior Shipment
Type of Artwork to Be Supplied
Email File, Gerber RS-274-X, PCB.Doc etc
Service Area
Worldwide, Globally
Transport Package
Normal Packaging
Specification
≤18" x 24"
Trademark
bicheng
Origin
Shenzhen China
HS Code
7409190000
Production Capacity
360000 Square Meters/Year

Packaging & Delivery

Package Size
81.00cm * 50.00cm * 10.00cm
Package Gross Weight
5.000kg

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)

Overview of This Type of Laminate

RT/duroid 5880 is a glass microfiber reinforced PTFE composite designed for high-performance stripline and microstrip printed circuit board applications. With a dielectric constant of 2.20 and ultra-low dissipation factor, it provides exceptional electrical consistency and signal integrity, making it suitable for demanding RF and microwave systems up to Ku-band and beyond.


Technical Features & Benefits

Low and Stable Dielectric Constant: Dk = 2.20 ±0.02 at 10 GHz, with excellent uniformity across panels and frequency stability.

Ultra-Low Loss: Dissipation factor as low as 0.0009 at 10 GHz, supporting high-frequency, low-loss designs.

Excellent Thermal Stability: Thermal coefficient of εr = -125 ppm/°C, ensuring reliable performance across temperature ranges.

High Electrical Insulation: Volume resistivity ≥2×107 MΩ·cm and surface resistivity ≥3×107 MΩ.

Good Mechanical Properties: Balanced tensile and compressive modulus for reliable PCB fabrication and assembly.

lity.


Rogers Rt/Duroid 5880 RF PCB Laminate for High-Frequency Electronics

Typical Properties

Property Direction Units [3] Condition RT/duroid 5880 Test Method
Dielectric Constant, εr (Process) Z - C24/23/50, 10 GHz 2.20 ± 0.02 IPC-TM-650 2.5.5.5
Dielectric Constant, εr (Design) Z - 8-40 GHz 2.20 Differential Phase Length Method
Dissipation Factor, tan δ Z - C24/23/50, 10 GHz 0.0009 IPC-TM-650 2.5.5.5
Thermal Coefficient of εr Z ppm/°C -50°C to 150°C -125 IPC-TM-650 2.5.5.5
Volume Resistivity Z MΩ·cm C96/35/90 2×107 ASTM D257
Surface Resistivity Z C96/35/90 3×107 ASTM D257
Tensile Modulus (X) X MPa (kpsi) 23°C 1070 (156) ASTM D638
Tensile Modulus (Y) Y MPa (kpsi) 23°C 860 (125) ASTM D638
Compressive Modulus (Z) Z MPa (kpsi) 23°C 940 (136) ASTM D695
Moisture Absorption N/A % D48/50, 0.062" 0.02 ASTM D570
Thermal Conductivity Z W/(m·K) 80°C 0.20 ASTM C518
Coefficient of Thermal Expansion (X) X ppm/°C 0-100°C 31 IPC-TM-650 2.4.41
Coefficient of Thermal Expansion (Y) Y ppm/°C 0-100°C 48 IPC-TM-650 2.4.41
Coefficient of Thermal Expansion (Z) Z ppm/°C 0-100°C 237 IPC-TM-650 2.4.41
Density N/A g/cm³ N/A 2.2 ASTM D792
Copper Peel Strength N/A pli (N/mm) 1 oz EDC after solder float 31.2 (5.5) IPC-TM-650 2.4.8
Flammability N/A - N/A V-0 UL94
Lead-Free Process Compatible N/A - N/A Yes N/A
 
 

APPLICATION AREAS

RF & Microwave Circuits: Stripline and microstrip designs for communication systems.

Ku-band and Above Applications: Satellite communications, radar systems.

Aerospace & Defense: Avionics, phased array antennas, electronic warfare.

Test & Measurement: High-frequency probes, calibration substrates.

Medical Electronics: High-frequency imaging and diagnostic equipment.

Available Configurations:
Copper Cladding: Electrodeposited (½ oz to 2 oz), reverse-treated EDC, or rolled copper foil.
Panel Sizes: 18" × 12" (457 × 305 mm) and 18" × 24" (457 × 610 mm); other sizes available.
Thickness Range: From 0.005" (0.127 mm) to 0.375" (9.525 mm) with tight tolerances.
Special Claddings: Aluminum, copper, or brass plates for heat sinking and mechanical support.

Tags:RT/duroid 5880, PTFE glass microfiber PCB, Dk 2.20, ultra-low loss, RF/microwave printed circuit board, Ku-band electronic board, low Dk laminate


Others:
Quality standard: IPC-Class-2

Availability: Worldwide


Why Choose Us?
1. Engineering design prevents problems from occurring in pre-production;
2. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
3. AOI inspection;
4. Delivery on time higher than 98% on-time-delivery rate;
5. 16000m2 workshop;
6. 30000m2 output capability per month;
7. 8000 types of PCB's per month;
8. Quick CADCAM checking and free PCB quotation;
9. More than 18+ years of PCB experience;
10. Customer complaint rate: <1%

 

Rogers Rt/Duroid 5880 RF PCB Laminate for High-Frequency Electronics
Rogers Rt/Duroid 5880 RF PCB Laminate for High-Frequency Electronics
Rogers Rt/Duroid 5880 RF PCB Laminate for High-Frequency Electronics
 
 
 
Rogers Rt/Duroid 5880 RF PCB Laminate for High-Frequency Electronics
Rogers Rt/Duroid 5880 RF PCB Laminate for High-Frequency Electronics

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