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| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | High Frequency RF Microwave PCB |
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(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Introduction to RO4003C LoPro 2-Layer PCB
This 2-layer rigid PCB is constructed with Rogers RO4003C LoPro as the base material. RO4003C LoPro laminates use a proprietary Rogers technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining the other desirable attributes of the standard RO4003C laminate system. RO4003C hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes and does not require specialized via preparation such as sodium etch for lower manufacturing cost. The board features silver underplating with gold plating surface finish, green top solder mask, white top silkscreen, and is 100% electrically tested prior to shipment.
Key Features of RO4003C LoPro
Dielectric constant (Dk): 3.38 ±0.05 at 10 GHz / 23°C
Dissipation factor (Df): 0.0027 at 10 GHz / 23°C
Thermal decomposition temperature (Td): >425°C
Tg: >280°C (TMA method)
Thermal conductivity: 0.64 W/m·K
Low Z-axis CTE: 46 ppm/°C
CTE X-axis (-55 to 288°C): 11 ppm/°C (matched to copper)
CTE Y-axis (-55 to 288°C): 14 ppm/°C (matched to copper)
Lead-free process compatible
CAF resistant
Benefits of RO4003C LoPro 2-Layer PCB
Lower insertion loss allows for higher operating frequency designs even greater than 40 GHz
Reduced passive inter-modulation (PIM) for base station antennas
Improved thermal performance due to lower conductor loss
Multilayer PCB capability
Design flexibility
High temperature processing
Meets environmental concerns
CAF resistant
FR-4 process compatible with no specialized via preparation required
Reverse treated LoPro foil provides low conductor loss for improved signal integrity
RO4003C LoPro 2-Layer PCB Construction Details
| Item | Specification |
|---|---|
| Base material | RO4003C LoPro (Rogers) |
| Layer count | 2 layers |
| Board dimensions | 64mm x 68.4mm = 1PCS |
| Minimum trace/space | 5/5 mils |
| Minimum hole size | 0.3mm |
| Blind vias | No |
| Finished board thickness | 0.65mm |
| Finished copper weight | 1 oz (1.4 mils) outer layers |
| Via plating thickness | 20 μm |
| Surface finish | Silver underplating + Gold plating |
| Top silkscreen | White |
| Bottom silkscreen | No |
| Top solder mask | Green |
| Bottom solder mask | No |
| 100% electrical test | Used prior to shipment |
PCB Stackup (2-Layer Rigid Structure)
Copper layer 1: 35 μm
Rogers RO4003C LoPro Substrate: 0.526 mm (20.7 mil)
Copper layer 2: 35 μm
PCB Statistics
Components: 12
Total pads: 61
Thru hole pads: 29
Top SMT pads: 32
Bottom SMT pads: 0
Vias: 39
Nets: 2
Primary Application Areas
Digital applications such as servers, routers, and high speed backplanes
Cellular base station antennas and power amplifiers
LNBs for direct broadcast satellites
RF identification tags
Quality Assurance
Type of artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-2
Availability: Worldwide
RO4003C LoPro High-Frequency Laminate - Product Introduction
RO4003C LoPro laminates use a proprietary Rogers technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4003C laminate system. RO4000 hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes offered at competitive prices. RO4000 material possesses the properties needed by designers of RF microwave circuits, matching networks, and controlled impedance transmission lines. Low dielectric loss allows RO4000 series material to be used in many applications where higher operating frequencies limit the use of conventional circuit board laminates. The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range, making it an ideal substrate for broadband applications. RO4000 material's thermal coefficient of expansion (CTE) is similar to that of copper, allowing excellent dimensional stability for mixed dielectric multilayer board constructions. The low Z-axis CTE provides reliable plated through-hole quality, even in severe thermal shock applications. RO4000 series laminates can easily be fabricated into printed circuit boards using standard FR-4 circuit board processing techniques. Unlike PTFE based high performance materials, RO4000 series laminates do not require specialized via preparation processes such as sodium etch.
Features and Benefits of RO4003C LoPro
| Feature | Value |
|---|---|
| Material type | Hydrocarbon ceramic with LoPro reverse treated foil |
| Dielectric constant (process) | 3.38 ±0.05 at 10 GHz / 23°C |
| Dielectric constant (design) | 3.50 at 8-40 GHz |
| Dissipation factor | 0.0027 at 10 GHz / 23°C, 0.0021 at 2.5 GHz / 23°C |
| Thermal coefficient of Dk | +40 ppm/°C (-50 to 150°C) |
| Volume resistivity | 1.7 x 1010 MΩ·cm (COND A) |
| Surface resistivity | 4.2 x 109 MΩ (COND A) |
| Electrical strength | 31.2 KV/mm (780 V/mil) at 0.51mm |
| Tensile modulus | 26,889 MPa (3,900 kpsi) at RT |
| Tensile strength | 141 MPa (20.4 kpsi) at RT |
| Flexural strength | 276 MPa (40 kpsi) |
| Dimensional stability | <0.3 mm/m after etch + E2/150°C |
| CTE X-axis | 11 ppm/°C (-55 to 288°C) |
| CTE Y-axis | 14 ppm/°C (-55 to 288°C) |
| CTE Z-axis | 46 ppm/°C (-55 to 288°C) |
| Tg | >280°C (TMA method) |
| Td | 425°C (TGA method) |
| Thermal conductivity | 0.64 W/m/°K at 80°C |
| Moisture absorption | 0.06% (48 hrs immersion, 50°C) |
| Density | 1.79 g/cm³ at 23°C |
| Copper peel strength | 1.05 N/mm (6.0 pli) after solder float, 1 oz TC foil |
| Lead-free process compatible | Yes |
Benefits:
Low conductor loss for improved insertion loss and signal integrity
Reverse treated LoPro foil bonds to standard RO4003C dielectric
FR-4 process compatible with no specialized via preparation
Reduced passive inter-modulation (PIM) for base station antennas
Lower insertion loss allows for higher operating frequency designs beyond 40 GHz
Improved thermal performance due to lower conductor loss
Multilayer PCB capability and design flexibility
High temperature processing capability
CAF resistant and meets environmental concerns
RO4003C LoPro Data Sheet
| Property | Typical Value | Direction | Units | Conditions | Test Method |
|---|---|---|---|---|---|
| Dielectric constant (process) | 3.38 ±0.05 | Z | - | 10 GHz / 23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric constant (design) | 3.50 | Z | - | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation factor | 0.0027 | Z | - | 10 GHz / 23°C | IPC-TM-650 2.5.5.5 |
| Dissipation factor | 0.0021 | Z | - | 2.5 GHz / 23°C | IPC-TM-650 2.5.5.5 |
| Thermal coefficient of Dk | +40 | Z | ppm/°C | -50 to 150°C | IPC-TM-650 2.5.5.5 |
| Volume resistivity | 1.7 x 1010 | - | MΩ·cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface resistivity | 4.2 x 109 | - | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical strength | 31.2 (780) | Z | KV/mm (V/mil) | 0.51mm (0.020") | IPC-TM-650 2.5.6.2 |
| Tensile modulus | 26,889 (3,900) | Y | MPa (kpsi) | RT | ASTM D638 |
| Tensile strength | 141 (20.4) | Y | MPa (kpsi) | RT | ASTM D638 |
| Flexural strength | 276 (40) | - | MPa (kpsi) | - | IPC-TM-650 2.4.4 |
| Dimensional stability | <0.3 | X,Y | mm/m | after etch + E2/150°C | IPC-TM-650 2.4.39A |
| CTE X-axis | 11 | X | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
| CTE Y-axis | 14 | Y | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
| CTE Z-axis | 46 | Z | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
| Tg | >280 | - | °C | TMA method | IPC-TM-650 2.4.24.3 |
| Td | 425 | - | °C | TGA method | ASTM D3850 |
| Thermal conductivity | 0.64 | - | W/m/°K | 80°C | ASTM C518 |
| Moisture absorption | 0.06 | - | % | 48 hrs immersion, 50°C | ASTM D570 |
| Density | 1.79 | - | g/cm³ | 23°C | ASTM D792 |
| Copper peel strength | 1.05 (6.0) | - | N/mm (pli) | after solder float, 1 oz TC foil | IPC-TM-650 2.4.8 |
| Lead-free process compatible | Yes | - | - | - | - |
Some Typical Applications
Digital applications such as servers, routers, and high speed backplanes
Cellular base station antennas and power amplifiers
LNBs for direct broadcast satellites
RF identification tags
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