F4bm255 PTFE Glass Fabric Laminate for High-Frequency Electronics PCB

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Product Details
Customization: Available
Type: Rigid Laminate
Dielectric: PTFE Glass Fabric Copper-Clad Laminate
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  • F4bm255 PTFE Glass Fabric Laminate for High-Frequency Electronics PCB
  • F4bm255 PTFE Glass Fabric Laminate for High-Frequency Electronics PCB
  • F4bm255 PTFE Glass Fabric Laminate for High-Frequency Electronics PCB
  • F4bm255 PTFE Glass Fabric Laminate for High-Frequency Electronics PCB
  • F4bm255 PTFE Glass Fabric Laminate for High-Frequency Electronics PCB
  • F4bm255 PTFE Glass Fabric Laminate for High-Frequency Electronics PCB
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Basic Info.

Model NO.
BIC-1646-V3.0
Material
F4bm255
Application
Microwave, RF, Radar
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Bare Copper,Electrodeposited Copper
Base Material
F4bm255
Insulation Materials
PTFE
Brand
Wangling
Board Types
Rigid Laminate
Test
100% Electrical Test Prior Shipment
Type of Artwork to Be Supplied
Email File, Gerber RS-274-X, PCB.Doc etc
Service Area
Worldwide, Globally
Transport Package
Shipping Vacuum Packaging
Specification
≤18"×24"
Trademark
bicheng
Origin
Shenzhen China
HS Code
7409190000
Production Capacity
360000 Square Meters/Year

Packaging & Delivery

Package Size
81.00cm * 50.00cm * 10.00cm
Package Gross Weight
5.000kg

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)

Overview of This Type of Laminate
F4BM is a PTFE glass fabric copper-clad laminate developed by Taizhou Wangling Insulation Material Factory. It is composed of glass fiber cloth, PTFE resin, and PTFE film, offering improved electrical performance over standard F4B, including a wider range of dielectric constants, lower loss, higher insulation resistance, and greater stability. F4BM255 is one variant within this series with a dielectric constant of 2.55. F4BM is paired with standard ED copper foil and is suitable for applications without PIM requirements.


Technical Features:
Selectable Dielectric Constant (Dk) from 2.17 to 3.0; customizable Dk.
Low loss (low dissipation factor).
Good dimensional stability and enhanced size control.
Radiation resistance, low outgassing.
Commercialized, high-volume, cost-effective production.
Dimensional stability improves with higher Dk (higher glass content).
UL 94 V-0 flammability rating.

F4bm255 PTFE Glass Fabric Laminate for High-Frequency Electronics PCB


Typical Properties:

Properties Test Conditions Unit F4BM255
Electrical Properties      
Dielectric Constant (Typical) 10 GHz - 2.55
Dielectric Constant Tolerance / - ±0.05
Dissipation Factor (Typical) 10 GHz - 0.0013
  20 GHz - 0.0018
Temperature Coefficient of Dk -55°C to 150°C ppm/°C -110
Peel Strength 1 oz. F4BM N/mm >1.8
Volume Resistivity Normal Condition MΩ·cm ≥6×106
Surface Resistance Normal Condition ≥1×106
Dielectric Strength (Z-direction) 5 kW, 500 V/s kV/mm >25
Breakdown Voltage (XY-direction) 5 kW, 500 V/s kV >34
Thermal & Mechanical Properties      
CTE XY-direction, -55°C to 288°C ppm/°C 16~21
  Z-direction, -55°C to 288°C ppm/°C 173
Thermal Stress 260°C, 10s, 3 cycles - No Delamination
Water Absorption 20±2°C, 24 hours % ≤0.08
Density Room Temperature g/cm³ 2.25
Long-term Operating Temperature High/Low Temp Chamber °C -55 to +260
Thermal Conductivity Z-direction W/(m·K) 0.33
PIM Value Applicable only to F4BME series dBc ≤-159
Flammability Rating / UL-94 V-0
Material Composition / / PTFE, Glass Fiber Cloth; F4BM uses ED copper foil.
 
 

Application Areas:

Microwave, RF, Radar

Phase Shifters, Passive Components

Power Dividers, Couplers, Combiners

Feed Networks, Phased Array Antennas

Satellite Communication, Base Station Antennas
 

Available Configurations:

Copper Foil Options for F4BM: ED Copper Foil. Available thicknesses: 0.5 oz (0.018mm), 1 oz (0.035mm), 1.5 oz (0.05mm), 2 oz (0.07mm).

  • Standard Panel Sizes Available:

    • 460 × 610 mm

    • 500 × 600 mm

    • 850 × 1200 mm

    • 914 × 1220 mm

    • 1000 × 1200 mm

  • Available Thicknesses & Tolerances (Conventional):

    • Thickness (mm): 0.1 (core), 0.127 (core), 0.2, 0.25, 0.5, 0.508, 0.762, 0.8, 1.0, 1.5, 1.524, 1.575, 2.0, 2.5, 3.0, 4.0, 5.0, 6.0, 8.0, 10.0, 12.0.

    • Corresponding tolerances range from ±0.01mm to ±0.20mm.

    • Note: For Dk ≤ 2.65, minimum core thickness is 0.1mm. For Dk 2.7-3.0, minimum core thickness is 0.2mm.

  • F4BM Series with Metal Core (Aluminum/Copper Base):

    • Models: F4BM*-AL (Aluminum base), F4BM*-CU (Copper base).

    • Serves for shielding or heat dissipation.

    • Example: F4BM255-AL represents F4BM255 with an aluminum base.

    • Standard sizes available: 460×610 mm, 460×305 mm. Other sizes upon request.

 

Tags: F4BM255, PTFE PCB, low loss, Dk 2.55, high thermal stability, V-0, PIM performance, wide temperature range, RF microwave, cost-effective.


Quality standard: IPC-Class-2
Availability: Worldwide


Why Choose Us?
1. Engineering design prevents problems from occurring in pre-production;
2. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
3. AOI inspection;
4. Delivery on time higher than 98% on-time-delivery rate;
5. 16000m2 workshop;
6. 30000m2 output capability per month;
7. 8000 types of PCB's per month;
8. Quick CADCAM checking and free PCB quotation;
9. More than 18+ years of PCB experience;
10. Customer complaint rate: <1%

 

F4bm255 PTFE Glass Fabric Laminate for High-Frequency Electronics PCB
F4bm255 PTFE Glass Fabric Laminate for High-Frequency Electronics PCB
F4bm255 PTFE Glass Fabric Laminate for High-Frequency Electronics PCB
 
 
 
F4bm255 PTFE Glass Fabric Laminate for High-Frequency Electronics PCB
F4bm255 PTFE Glass Fabric Laminate for High-Frequency Electronics PCB

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