Today we're going to talk about a cutting-edge technology that's revolutionizing the world of printed circuit board substrates - Rogers IsoClad 917 laminates. These laminates are made up of non-woven fiberglass and PTFE composites in a low ratio, which helps them achieve the lowest possible dielectric constant and dissipation factor in their class.
The non-woven fiberglass reinforcement enables them to be used in applications where the printed circuit board requires bending or shaping, such as in conformal or wrap-around antennas. Furthermore, the laminates' longer random fibers and its proprietary manufacturing process result in greater dimensional stability and uniformity of dielectric constant, surpassing those of similar laminates in the market.
Our discussion will begin with an overview of the typical properties of IsoClad 917
Data sheet One of the key features is its dielectric constant, measuring 2.17 or 2.20 depending on the specific formulation.
IsoClad 917 also has a very low dissipation factor of 0.0013 at 10 GHz, which indicates that it can transmit signals with very little loss of energy.
It has a high volume resistivity of 1.5 x 10^10 MΩ-cm and high surface resistivity of 1.0 x 10^9 MΩ.
It also has a long arc resistance of over 180 seconds and a high dielectric breakdown voltage of over 45 kV.
In terms of thermal properties, IsoClad 917 has a thermal coefficient of Er of -157 ppm/°C, which means that its dielectric constant can change by that amount for every degree Celsius of temperature change. Of course, some times we may prefer it can be more lower.
It exhibits a low coefficient of thermal expansion of 46 ppm/°C in the X-axis, 47 ppm/°C in the Y-axis, and 236 ppm/°C in the Z-axis.
However, It has a thermal conductivity of only 0.263 W/mK at 100°C.
Additionally, IsoClad 917 has good mechanical properties, with a peel strength of 10 lbs. per inch after thermal testing, a tensile modulus of 133-120 kpsi, a tensile strength of 4.3-3.8 kpsi, a compressive modulus of 182 kpsi, and a flexural modulus of 213 kpsi.
The density of IsoClad 917 is 2.23 g/cm3 at 23°C, as measured by ASTM D-792 Method A. This gives the material a relatively high weight-to-volume ratio, which can be useful in some particular applications.
In terms of water absorption, It has a relatively low rate of 0.04% as measured by E1/105 + D24/23. This means that the material is less likely to be affected by moisture in the environment.
Move to the outgassing properties.
The total mass loss is minimal at 0.02%, with a maximum allowable of 1.00% in the condition of ≤10-6 torr at 125°C.
Likewise, the collected volatile condensablematerial is 0.00%, with a maximum allowable of 0.10%. There is no condensable material present.
The water vapor regain is only 0.02%.
Visible condensate is not present.
Finally, IsoClad 917 meets the requirements of UL94-V0 for flammability.
There are several options for the layer count, including single-sided boards, double-sided boards, multi-layer boards, and hybrid designs.
Copper weights on tracks and padsare available with 1oz (35µm) and 2oz (70µm).
Dielectric thicknesses are available with 20mil (0.508mm), 31mil (0.787mm), and 62mil (1.575mm).
The maximum size of circuit boards is within 400mm by 500mm. It can be a single large board with such size or different multiple designs in this sheet.
Different solder mask options such as green, black, blue, yellowand red are provided to suit your design needs.
We also offer a variety of surface finishes, including immersion gold, HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold plating etc.
A piece of PCB
On the screen is a type of IsoClad 917 PCB built with hybrid design.
IsoClad 917 also finds its typical applications in a range of electronic systems such as conformal antennas, stripline and microstrip circuits, guidance systems and radar systems etc.
Shot 5: Host IsoClad 917 material is compatible with a variety of manufacturing tooling systems. The choice of using round or slotted pins, external or internal pinning, standard or multiline tooling, and pre- vs. post-etch punching will depend on the capabilities and preferences of the circuit manufacturing facility, as well as the final registration requirements. In most cases, using slotted pins, a multiline tooling format, and post-etch punching will be sufficient. It is recommended to retain copper around tooling holes regardless of the approach taken.
A flow pattern that works with the selected adhesive system can be applied between circuits and around the panel's perimeter. However, in general, keeping as much copper as possible will improve layer registration.
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