RO3010 Laminate Double-Sided Copper Clad Raw Materials Using in RF Microwave Application

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: RO3010 Laminate
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  • RO3010 Laminate Double-Sided Copper Clad Raw Materials Using in RF Microwave Application
  • RO3010 Laminate Double-Sided Copper Clad Raw Materials Using in RF Microwave Application
  • RO3010 Laminate Double-Sided Copper Clad Raw Materials Using in RF Microwave Application
  • RO3010 Laminate Double-Sided Copper Clad Raw Materials Using in RF Microwave Application
  • RO3010 Laminate Double-Sided Copper Clad Raw Materials Using in RF Microwave Application
  • RO3010 Laminate Double-Sided Copper Clad Raw Materials Using in RF Microwave Application
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Basic Info.

Model NO.
BIC-1590-V1.0
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Aluminum
Insulation Materials
Hydrocarbon Resin
Brand
Rogers
Tihickness
8mil, 12mil, 20mil, 32mil and 60mil
Soldermask Color
Blcak, Blue, Yellow, Red, Green...
Transport Package
Packing
Specification
≤ 400mm X 500mm
Trademark
Bicheng
Origin
China
HS Code
8534009000
Production Capacity
10000PCS/Year

Product Description

RO3010 High Frequency PCB

Today we'll spend a few minutes to talk about a ceramic-filled PTFE composite that offers exceptional electrical and mechanical stability.

Rogers' RO3010 high frequency circuit laminates are ceramic-filled PTFE composites designed for commercial microwave and radio frequency applications. These laminates possess excellent electrical properties and consistent mechanical properties, allowing our designers to create multilayer boards designs that use different dielectric constant materials for individual layers without experiencing any warpage or reliability issues.

DATA SHEET

RO3010 Laminate Double-Sided Copper Clad Raw Materials Using in RF Microwave Application
The data sheet shows a variety of different properties of the material.

The dielectric constant of RO3010 material is typically 10.2 with a tolerance of ±0.15.

It also has a dissipation factor of 0.0022, which makes it an excellent choice for high frequency circuits requiring low signal loss.

However, the thermal coefficient of dielectric constant in the Z direction is −395 ppm/°C at 10 GHz ranging -50ºCto 150ºC. This value actually performs high which is not suitable for temperature sensitive working sites.

The dimensional stability of RO3010 is worthy of attention, in X and Y direction, there's only 0.35 and 0.31 mm/m. This means the material is less likely to warp or deform during manufacturing, ensuring the final product meet specifications.

The volume resistivity and surface resistivity are also impressive, at 105 MΩ.cm and 105 MΩ respectively. This resistivity helps control the flow of electricity within the circuit and ensures efficient transmission of signals.

RO3010 exhibits a tensile modulus in excess of 1900 MPa in the X and Y directions.  

The moisture absorption is 0.05%, indicating its resistance to water intrusion.

In addition, the specific heat capacity was calculated at 0.8 J/g/K, demonstrating its ability to absorb thermal energy.

Moreover, the thermal conductivity measured by the ASTM D 5470 method at a temperature of 50°C is 0.95 W/m/K, indicating a good thermal conductivity.

Carried out at 23°C and 50% relative humidity with test method of  IPC-TM-650 2.4.4.1., the material's coefficient of thermal expansion (CTE) in a temperature range of -55 to 288°C yields value of 13, 11, and 16 ppm/°C respectively in X, Y and Z direction. This is a pretty good result because the CTE is similar to that of copper, making the PCBs give excellent performance in the dimensional stability and plated-through-holes reliability.

RO3010 is resistant to decomposition temperatures up to 500°C.

Additionally, it was tested and confirmed to have a density of 2.8 gm/cm3 at 23°C.

RO3010 has a copper peel strength of 9.4 lbs/in after solder float measured on IPC-TM 2.4.8 using 1oz ED copper.

It is classified as V-0 flammability according to UL 94 standard and has the advantage of being compatible with lead-free processes as well.


PCB Capability

RO3010 Laminate Double-Sided Copper Clad Raw Materials Using in RF Microwave Application
For RO3010 PCB, it is available with double layer, multilayer and hybrid designs.

It is available in a range of copper weight options such as 1oz (35µm) and 2oz (70µm),

and the PCB thickness can be customized with options including 5mil (0.127mm), 10mil (0.254mm), 25mil (0.635mm) and 50mil (1.27mm).  

The maximum PCB size of RO3010 is within 400mm X 500mm. It can be a single board size or multiple designs in the panel.

We also offers solder mask in various colors including green, black, blue, yellow, red, white and more.

Further more, we provides different surface treatment options as well, such as immersion gold, HASL, immersion silver, immersion tin, bare copper, and OSP to meet different requirements.

RO3010 Laminate Double-Sided Copper Clad Raw Materials Using in RF Microwave Application

Displayed on the screen is a 60mil RO3010 PCB with immersion silver coating for power amplifiers and antennas.

They can be also found in the field of automotive radar applications, GPS antennas, patch antennas for wireless communications, and direct broadcast satellite etc.



The manufacturing process of RO3010 high frequency PCB is similar to standard PTFE PCB. Developers, strippers, and copper etchants used to process epoxy glass materials will also work with RO3010. So it's suitable for volume manufacturing process to win advantageous market.

Should you have any questions, please feel free to contact us.
Thank you for your watching. We'll see you next time.
RO3010 Laminate Double-Sided Copper Clad Raw Materials Using in RF Microwave Application


 

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