Rogers Tmm10 High Frequency PCB Wholesale Electronics Board for Chip Testers

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-148-V2.1
• Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Rogers
• Thickness: 15mil
• Layer Count: 2-Layer
• Application: Stripline and Microstrip
• Surface Finish: Immersion Gold
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

10Mil Rogers TMM10 High Frequency PCB Wholesale Electronics  board for Chip Testers
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Rogers' TMM10 thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications.


The electrical and mechanical properties of TMM10 laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials.

TMM10 laminates have an exceptionally low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. The material's isotropic coefficients of thermal expansion, very closely matched to copper, allow for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM10 laminates is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.

TMM10 laminates are based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.
 

Typical Applications:
1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems


Our PCB Capabilities (TMM10)  

PCB Capability (TMM10)
PCB Material:	Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation:	TMM10
Dielectric constant:	9.20 ±0.23
Layer count:	Single Layer, Double Layer, Multilayer, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
PCB thickness:	15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm),        150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm),         275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion Silver, Immersion Tin, ENEPIG, Pure Gold, OSP etc..

Data Sheet of TMM10 

TMM10 Typical Value
Property		TMM10	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess		9.20±0.23	Z		10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign		9.8	-	-	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor (process)		0.0022	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant		-38	-	ppm/°K	-55ºC-125ºC	IPC-TM-650 2.5.5.5
Insulation Resistance		>2000	-	Gohm	C/96/60/95	ASTM D257
Volume Resistivity		2 x 108	-	Mohm.cm	-	ASTM D257
Surface Resistivity		4 x 107	-	Mohm	-	ASTM D257
Electrical Strength(dielectric strength)		285	Z	V/mil	-	IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)		425	425	ºCTGA	-	ASTM D3850
Coefficient of Thermal Expansion - x		21	X	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y		21	Y	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z		20	Z	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity		0.76	Z	W/m/K	80 ºC	ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress		5.0 (0.9)	X,Y	lb/inch (N/mm)	after solder float 1 oz. EDC	IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)		13.62	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)		1.79	X,Y	Mpsi	A	ASTM D790
Physical Properties
Moisture Absorption (2X2)	1.27mm (0.050")	0.09	-	%	D/24/23	ASTM D570
	3.18mm (0.125")	0.2
Specific Gravity		2.77	-	-	A	ASTM D792
Specific Heat Capacity		0.74	-	J/g/K	A	Calculated
Lead-Free Process Compatible		YES	-	-	-	-