Ad350A High-Power PTFE Thermal Management PCB Plated Immersion Silver Finish for Low-Pim Antenna Board

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Ad350A
• Model NO.: BIC-1124-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

AD350A High-Thermal PCB - 0.8mm Thin, 4/4 Mils Trace/Space with Enhanced Heat Dissipation
(Engineered for high-power RF applications requiring superior thermal management)


1. Product Overview
This 2-layer high-frequency PCB utilizes Rogers AD350A laminate, a specialized ceramic-filled PTFE composite designed for power-sensitive RF applications. With exceptional thermal conductivity (0.44 W/m-K) and ultra-stable CTE (18/18/63 ppm/°C), it solves thermal challenges in 5G base stations, automotive radar, and satellite systems while maintaining excellent RF performance.

Key Advantages
Thermal Superstar: 3× better heat dissipation than standard PTFE materials

Precision RF Performance: Dk 3.5±0.05 @10GHz with 0.003 loss tangent

High-Density Ready: 4/4 mils trace/space with 0.3mm micro-vias

Reliability Focused: -163dBc PIM (60mil), 100% electrical tested


2. Technical Specifications

Parameter	Specification
Construction	2-layer rigid PCB
Dimensions	102.02mm × 65.54mm (1-up)
Thickness	0.8mm (30mil AD350A core)
Copper Weight	1oz (35µm) both sides
Trace/Space	4/4 mils (minimum)
Hole Size	0.3mm (mechanical)
Surface Finish	Immersion Silver
Plating	20µm via walls
Thermal Conduct.	0.44 W/m-K (@100°C)

3. Material Breakthroughs
AD350A Thermal Advantages
I. Z-axis CTE 35ppm/°C - Prevents PTH cracking in thermal cycling
II. 0.44 W/m-K Conductivity - Actively pulls heat from power components
III. Moisture Resistance - 0.1% absorption for humid environments


RF Performance Highlights
a) Dk Stability ±0.05 tolerance across temperature swings
b) -163dBc PIM (60mil) for interference-free operation
c) X/Y CTE 18ppm/°C - Matches component expansion rates


4. Design Specifications

Stackup Structure
Top Layer: 35μm Cu  
Core: 0.762mm AD350A  
Bottom Layer: 35μm Cu  

Board Statistics
• 54 components (90 thru-hole, 33 SMT)
• 123 total pads, 76 vias
• 3 nets (optimized for RF routing)

Compliance
• IPC-Class-2
• RoHS compliant
• Gerber RS-274-X format


5. Target Applications
▸ 5G Massive MIMO Antennas - Handles power amplifier heat
▸ Automotive 77GHz Radar - Stable in engine bay temperatures
▸ LNB Satellite Modules - Low PIM for signal clarity
▸ Military Comms - Reliable in extreme conditions


6. Why Engineers Choose This Board

For Thermal Teams
→ 40% better heat dissipation vs. standard PTFE
→ Maintains impedance control at high temps

For RF Engineers
→ 4/4 mils routing for compact antenna arrays
→ Silver finish preserves high-frequency performance

For Procurement
→ Worldwide availability
→ FR-4-like fabrication costs


Request Your Thermal-RF Solution Today
Contact our engineering team for:
• Custom thermal simulations
• Impedance control reports
• High-volume production quotes
(Prototypes ship in 5 days - Full documentation available)




Thank you for your reading and you're welcome to contact us for your PCB enquiries.